• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a laser arrangement (2) for cleaning one or more baking surfaces (1) of a baking machine, comprising a laser head (3), wherein an interface for connection to the baking machine is provided, and that the laser arrangement mechanically and / or tax technology with the baking machine is coupled, a baking machine with a laser arrangement according to the invention (2) and a method for cleaning baking surfaces, in which a laser head in the region of the baking surface of a baking machine is arranged, in which a laser beam is passed to clean the baking surface on the baking surface and in by Relative movement between the laser head and the baking surface of the processing area of the laser assembly is moved over the baking surface.
    公开号:AT513222A1
    申请号:T863/2012
    申请日:2012-08-03
    公开日:2014-02-15
    发明作者:Johannes Haas；Josef Haas；Georg Kalss；Stefan Jiraschek；Peter Buczolits；Martin Kaller
    申请人:Haas Food Equipment Gmbh；
    IPC主号:
    专利说明:

    • · • · · · · · · · · · · · · · · · · · ·
    51 069 GP / GA
    Method and device for cleaning baking surfaces
    The invention relates to a method and apparatus for cleaning baking surfaces, in particular for cleaning the surfaces of baking plates, baking molds or baking rings, for example for the production of flat wafers, hollow waffles, rolled bags, soft waffles, Waffelröllchen, hollow sticks, etc. Furthermore, the invention relates to a baking machine for Manufacture of the above or similar products comprising one or more baking surfaces and at least one device for cleaning the baking surfaces.
    Moreover, the invention relates to the use of the laser arrangement according to the invention for cleaning baking surfaces of the baking machines according to the invention.
    Baking machines, such as wafer baking machines for the industrial production of wafers comprise a furnace section in which open and closeable baking tongs are guided in a circumferentially driven manner. The dough to be baked or baking compound to be baked is introduced between the two baking plates of the baking tongs and baked under the action of temperature and optionally pressure. After the 2/34 j • ··· · ··· ··· ···
    · .. ··.% ·: 51 069 GP / GA
    Baking process, the baking tongs are opened and the finished baked waffle can be removed.
    In practice, the problem arises that left behind on the coming with the dough or the baking material in contact baking surfaces of the baking plates residues. These residues include, for example, oils, fats, starchy deposits, sugar deposits, etc. In order to remove these deposits from the baking surfaces and to clean them, different methods are currently used.
    For example, the baking tongs are individually opened in a cleaning mode of the baking machine and brushed by brushing. Another possibility, which corresponds to the state of the art, is to blow out the baking surfaces with compressed air.
    Cleaning the baking surfaces creates a conflict of objectives between thorough cleaning and gentle treatment of the baking surfaces. For example, when brushing the baking surfaces, it may occur that the surface is roughened or damaged. On the other hand, it is in many cases not possible with gentle treatment of the baking surface to remove the persistent incrustations or soiling.
    The object of the invention is to provide a device and a method for cleaning the baking surfaces, which reliably removes soiling, incrustations, deposits, etc. while causing no damage to the surface. Furthermore, it is an object of the invention that the method and the device can be used flexibly, in particular can be retrofitted to existing systems, as a modular device can be delivered if necessary, or is designed as an integral part of the baking machine. It is another object of the invention to provide a quick and easy cleaning option so that the production and the baking process does not have to be interrupted, or only briefly. A further object of the invention is that the device is inexpensive to manufacture and the method is favorable in carrying out. 3/34 • · I · · · · · • I I ·······················································
    * ·· * * · β * · ··· ** ·· * ··· * '51 069 GP / GA
    The objects according to the invention can be subsumed under the term efficient cleaning of baking surfaces.
    The object of the invention is achieved in that an interface for connection to the baking machine is provided, and that the laser assembly is coupled mechanically and / or tax technology with the baking machine. In addition, the objects according to the invention are achieved by a method which is characterized in that a laser head is arranged in the region of the baking surface of a baking machine, that a laser beam is passed to the baking surface for cleaning the baking surface and that by relative movement between the laser head and the baking surface the processing area of the laser assembly is moved over the baking surface.
    Furthermore, it can be provided according to the invention that the interface comprises a mechanical interface for coupling the laser arrangement to the baking machine and / or a control interface for coupling the control of the baking machine with the control of the laser arrangement, that a movement device for moving the laser head is provided, that the laser head along a first linear axis, a second linear axis and / or about a first axis of rotation is movable, wherein the axes are in predetermined alignment with the / the baking surfaces and / or that the moving device is a first support member for moving the laser head along a first linear axis, a second Carrier part for moving the laser head along a second linear axis, and / or a first axis of rotation for rotating or pivoting the laser head comprises.
    Optionally, the laser arrangement according to the invention is characterized in that an optical recording unit and a data processing unit are provided for detecting the contamination and / or the cleaning of the baking surfaces.
    Furthermore, the invention relates to a baking machine, wherein a laser arrangement is provided, wherein an interface for connection to the laser arrangement is provided, wherein the interface is a mechanical interface for coupling 4/34 ················································ · ··· ♦ ·· • 4 «* ·« ··· ···· «··· ·
    The laser arrangement with the baking machine and / or a control interface for coupling the control of the baking machine with the control of the laser arrangement, wherein the laser arrangement comprises a laser head, of which Laser radiation to a processing area on the baking surface is leitbar and that the laser head and the baking surface relative to each other at least have a drivable degree of freedom and / or wherein the baking surface and / or the laser head are drivable and movable by at least one drive.
    The baking machine is also characterized in that the laser head and / or the processing area along the baking surface is movable, wherein the direction of movement of the baking direction deviates and preferably transverse to this, that the baking machine is designed as a baking tongs, and that the laser assembly in a Is provided in the region of the baking tongs, in which the baking tongs are opened, that the laser assembly is provided in the region of the Vorkopfes, in the service area and / or in a reversing area that the baking machine comprises at least one baking tongs with a first and a second baking plate that at the a first baking surface and a second baking surface is provided on the second baking plate and that for cleaning the first baking surface to the second baking surface has an opening angle of 40 ° to 120 °, preferably greater than or equal to about 90 ° and / or that the baking machine as Ringbackmaschi ne is executed.
    The method optionally comprises the steps that the relative movement is achieved by movement of the baking surface and / or by movement of the laser head, that the laser head and / or the processing area is moved transversely to the baking direction of the baking surface, that the baking machine is designed as a baking tongs that in In the region of the Vorkopfs, in the service area or in the region of a deflection of the cleaning area is provided in which the baking tongs and the baking surfaces are opened by 90 ° or more, that is positioned in the baking surface of the laser head, that the laser head along the baking surface of the first baking plate is performed until the entire surface is cleaned by the laser beam, that possibly the second baking surface of the second baking plate is cleaned with the laser head, that the 5/34 ································ ·········································
    ··· ί ......... 51 069 GP / GA
    Back tongs is closed again that the subsequent baking plate is brought to the cleaning area and / or that the process is repeated.
    Method steps according to the invention can also be that the laser arrangement is connected to the baking machine, that for cleaning the second baking plate the laser head is pivoted about a first axis of rotation, that data is taken by an optical recording unit and for processing and / or influencing the cleaning process to a Data processing unit are passed and optionally stored that the data for detecting the degree of soiling and the contaminants of the baking surfaces are used and / or that the data associated with a baking plates or a portion of the baking surface are stored and fed to a controller for controlling the laser head in terms of laser power ,
    The method optionally includes the steps of connecting the laser head controller to the controller of the baking apparatus, using the data to control parameters such as the speed of progress, the laser intensity, the laser power, the machining area size, the oscillation frequency, and / or the oscillation amplitude and / or that the data is stored to document parameters such as the rate of progress, the laser intensity, the laser power, the machining area size, the oscillation frequency, and / or the oscillation amplitude.
    To achieve the objects according to the invention, a laser arrangement is used for cleaning the baking surfaces. In this case, any shape of a laser arrangement which is suitable for removing the contaminants from the baking surface can be used as the laser arrangement. However, commercially available industrial lasers are preferably used. These have, for example, a strip-shaped or square beam cross-section. The laser scans an approximately 120mm wide strip of the baking surface by oscillation. This strip corresponds to the processing area of the laser arrangement. Depending on the width of the strip, it may be necessary that the baking surface is not cleaned in one, but in several passes. Corresponds to the width of the working range of the 6/34 • I I · · ··· »····································································
    ·· «· ......... 51 069 GP / GA
    Laser arrangement of the width of the baking plate, so the processing can also be done in one step.
    Preferably, fiber lasers, CO2 lasers, YAG lasers are pulsed or used in continuous operation. Examples of useful laser arrays are a TEA-CO2 laser with a wavelength of 10.6pm or a fiber laser with a wavelength of 1.06pm.
    The laser power can be between 20 and 500 watts. Preferably, the power is about 100 to 200 watts. In practice, fiber lasers having a wavelength of 1.06 pm and a power of about 100 watts have proven particularly advantageous.
    The laser power actually required is also dependent on the oscillation frequency, the oscillation amplitude, the type and degree of contamination.
    The laser arrangement is connected or coupled according to the invention with a baking machine. For this purpose, both the baking machine and the laser arrangement on an interface. The interface can on the one hand be a control interface and on the other hand a mechanical interface.
    The control interface connects the means for controlling the laser arrangement and the means for controlling the baking machine with a control unit. In this case, a single control unit for controlling the laser arrangement and the baking machine can be suitable and / or set up, or a control device for the laser arrangement and a control device for the baking machine can be provided in each case. For example, the speed of the moving baking surfaces can be varied for cleaning. Furthermore, for example, in baking tongs machines, the opening angle of the baking tongs can be increased or changed for cleaning. Furthermore, the control of the laser assembly is dependent on the degree of soiling and the speed of the baking surface. For example, control parameters such as the laser power, the oscillation frequency or the oscillation amplitude can be changed by the connection via the interface. 7/34 * ··· · · · · · · · · ····································································
    ·· Τ * ........ 51 069 GP / GA
    Furthermore, if appropriate, the interface also relates to the mechanical connection and / or coupling of the laser arrangement to the baking machine. This interface is given for example by conventional connecting means such as screws, bolts, clamps, guide means, etc. In principle, any connection means which can serve for producing an interface, in particular the desired positioning of a laser arrangement on the baking machine, is suitable.
    The laser arrangement and the interface can be provided according to the invention in one or more cleaning areas. The cleaning area is defined as the area in which the baking surfaces are cleaned by the laser arrangement.
    According to the invention, an optical detection arrangement is further provided. This comprises an image acquisition unit and an image analysis unit. The optical detection arrangement serves among other things to determine the degree of contamination and the cleaning progress and the achieved degree of cleaning. If necessary, the data recorded by the detection arrangement can provide information as to whether the cleaning of the baking surface has been sufficiently carried out or whether a further cleaning cycle has to be carried out. Furthermore, the data on the cleaning progress and on the cleaning process can be stored. The storage of this data is used, for example, to create a cleaning protocol that helps to optimize the cleaning process. For example, parameters such as the intensity of the laser, the speed of the laser, the width of the laser stripe and the frequency of oscillation can be adjusted on the basis of the recorded and stored data. Further, the recorded data may include the cleaning parameters of the device such as the speed of progress, the laser intensity, the laser power, the machining area size, the oscillation frequency, the oscillation amplitude, etc., and thus record the detailed operation of the cleaning process. The recorded data are preferably linked to data of the baking machine. For example, the cleaning process can be tracked for each of the surrounding baking plates. Further, for example, at 8/34 • ····································································
    * · * 8 · ......... 51 069 GP / GA elongated or circular back surfaces identify certain areas of heavier or weaker contamination. The optical detection arrangement may comprise optical filters such as polarization filters for clear image recognition, for example of highly reflective, chromed surfaces. Furthermore, a cooling system can be provided for cooling the optical detection arrangement. However, it is preferred that the device be designed such that the temperature in the vicinity or at the optical detection arrangement is so low that no cooling is necessary. For example, a temperature that should not be exceeded is 80 ° C.
    The optical detection arrangement also serves to detect the degree of contamination. The degree of contamination can be used as a parameter for the regulation or control of the cleaning process. Particularly heavily soiled areas, for example, longer exposed to the laser radiation or be treated intensively by changing the oscillation frequency and / or the amplitude.
    In the method according to the invention, a high-intensity light beam, preferably a laser beam, is directed onto the baking surface by the device according to the invention. The baking surfaces are preferably formed of a metallic body and have a smooth surface or predetermined pattern-shaped relief structure. When the laser beam hits the baking surface, a large part of the radiation is reflected. However, if the laser beam hits a dirty spot or a dirt particle, the laser beam is absorbed by the dirt. The energy is converted into heat energy, which heats the debris or soiled area until combustion or evaporation occurs. Due to the different absorption or reflection properties of the contaminants and the baking surfaces, a particularly efficient and gentle cleaning is possible. The cleaning process is thus a substantially thermal process.
    Subsequently, some applications of the device according to the invention and of the method according to the invention will now be described. 9/34 ···········································································
    ·· V ......... 51 069 GP / GA
    According to a first embodiment, the laser arrangement according to the invention is provided on a baking machine with rotating, openable baking tongs. The baking tongs preferably have two baking surfaces. These each run on the inside of the baking plates, which are hingedly connected together to form a baking tongs. For baking, for example, waffles, the dough is introduced into the open baking tongs. Subsequently, the baking tongs are closed and baked for a certain time at a certain temperature. At the end of the baking process, the baking tongs are opened again to remove the ready-baked waffle. The opening and closing of the baking tongs happens for example via a link control. For cleaning the baking surfaces, the laser arrangement according to the invention is provided in the cleaning area in the region of the front pot, that is to say in the region of the dough infusion. When passing through this area, the baking tongs are opened to make dough infusion during production. However, the baking machine according to the invention also has a cleaning mode in which no dough infusion takes place. In cleaning mode, the laser assembly is positioned near the baking plates to direct the laser beam to the desired area of the baking surface. For this purpose, the laser assembly may be designed as a modular, removable module or be firmly connected to the frame of the baking machine. In a preferred manner, the laser head of the laser arrangement is arranged to be pivotable and / or displaceable. The displacement and the pivoting can be controlled and / or regulated by a control unit. Examples of drives are linear drives, rotary drives, etc. By controlling the displacement and / or rotation of the laser head, any areas of the baking surface can be processed by the laser head. The laser head has a processing area in which the laser can be moved in an oscillating manner. This working area can be guided over the entire baking surface to be processed. Furthermore, a laser arrangement may also be used, the processing area of which is substantially greater than or equal to the baking surface to be processed. In this case, cleaning takes place per baking surface in one step. If the processing area of the laser head is smaller than the area to be processed, the baking surface is cleaned in several steps or continuously. For this purpose, a relative movement between the laser head and the baking surface is generated by drives. In order to clean the entire desired baking surface, components of the movement can, on the one hand, be affected by the movement of the 10/34 baking tongs. »· · · · ·
    ·· tu * ........ 51 069 GP / GA
    Baking machine as well as a movement of the laser head can be achieved by a movement arrangement.
    In a further embodiment, the laser arrangement is provided in the so-called service area of the baking machine. The cleaning area is located in the region of that deflection point of the baking tongs, which is farther away from the infusion area. In the service area, the baking tongs are replaced by a suitable controller, e.g. opened a gate control. In turn, the laser arrangement according to the invention can either be temporarily mounted as a separate module for the cleaning process on the baking machine or can be fixedly provided on the baking machine. Again, the laser head is movable and controllably arranged to achieve cleaning of the entire desired baking surface. In particular, a pivoting movement is possible in order to be able to process both baking surfaces of the opened baking tongs. In a preferred way, the baking tongs are opened about 90 °. Thus, the laser head can be pivoted substantially by 90 ° to switch from the processing of the first baking surface for processing the second baking surface.
    According to a third embodiment, a baking machine with rotating, openable baking tongs is likewise provided with a laser arrangement according to the invention. This is provided in the cleaning area in the region of the rear deflection point, away from the infusion area. The baking tongs are opened in this embodiment, about 90 ° open to the deflection point. The laser head processes the baking surfaces in a substantially vertical position. In other words, the main extension direction of both baking surfaces of a baking tongs runs substantially vertically during cleaning by the laser arrangement.
    According to a fourth embodiment, the laser arrangement is arranged in the cleaning region of the front deflection point. Similar to the embodiment in which the laser arrangement is arranged in the region of the rear deflection point, in the present embodiment the laser is directed at at least one of the baking surfaces with the baking tongs open. The cleaning takes place at substantially vertical baking surfaces. 11/34 · · · · · · · · · · · ··· ··· ···
    · * Ff * ........ 51 069 GP / GA
    In all four above-mentioned embodiments of the device according to the invention, the laser arrangement can either be firmly connected to the baking machine or added as needed as a mobile unit.
    According to the invention, it may also be provided that the cleaning does not take place continuously, but only during a special cleaning operation or a cleaning mode. The cleaning is done in this embodiment only when the system is in the cleaning mode, i. the appropriate backplate temperature is given at the specified cleaning interval. The operating data of the cleaning and laser setting data during cleaning are logged and stored.
    The cleaning is preferably carried out already at a time when the baking plate has only slight contamination. This ensures that the lowest possible laser power is needed for the cleaning cycle. The intensity of the laser treatment must not lead to an impairment of the service life of the baking plates.
    Furthermore, it corresponds to the inventive idea that the movable and / or modular laser arrangement is docked to the baking machine and connected to the machine control. This modular unit can be used for multiple machines. The laser arrangement has an integrated protective device as well as an integrated suction device for separated dirt particles and is coupled to the machine control.
    As described, the laser assembly is connected to the machine control and / or connectable. This allows parameters such as the feed rate of the baking surfaces and the opening angle of the baking tongs and the control of Teigaufgusses can be adjusted in a cleaning mode. Furthermore, safety-relevant parameters can be taken into account via the common control unit of the baking machine and the laser arrangement. Such safety-relevant parameters are, for example, whether the laser assembly is properly connected to the baking machine, whether the shielding is properly positioned to shield the laser assembly and blasted debris and / or whether, for example, the suction is active. 12/34 · Μ · · ··· Μ · II »I» · · i · * · · · · · · ··· ·
    51 069 GP / GA • · ft * · · · · · ·
    In a preferred embodiment, the cleaning is performed by the laser assembly in a cleaning mode in which no regular operation of the baking machine for the production of baked products is performed. The time of the start of the cleaning mode can be determined by parameters such as the operating hours of the baking plates, the degree of soiling of the baking surfaces, the baking surface temperature, etc.
    Furthermore, the degree of contamination can also be taken into account by the connection of the control of the laser arrangement with the control device of the baking machine. In the case of particularly heavy soiling, the feed speed of the baking surfaces can be slowed down in order to carry out a more intensive cleaning. The determination of the degree of contamination can be done for example by the optical recording unit.
    Further, as noted, the optical pickup unit may also be used to document the cleaning progress. For example, each clean or dirty surface of the oven is photographed or filmed and the image is stored for follow-up. Furthermore, these images can also be evaluated immediately, the results for laser control and control of the baking machine can be used.
    For cleaning the baking surfaces, as noted, the laser head can be moved along several degrees of freedom. This movement corresponds, for example, to the linear movement along linear axes or the rotation through 90 °, in order to be able to clean a baking tongs, for example opened at 90 °. However, the movement of the laser head can similarly be replaced by the provision of mirror deflections. For example, the laser head can be fixedly provided on the laser arrangement. Mirrors can be used to deflect the laser beams. In particular, the rotation of the laser head about the axis of rotation can be replaced by the mirror arrangement. The linear axes for moving the laser along a straight line or along a plane remain in place. 13/34 4 • · · * ι «♦ ·« «« · · ·· * · Μ ··· i ο * «. · · · «· · · · · · · ·
    ·· 1 «* · ♦ · * · · 51 069 GP / GA The usual opening angle of the baking tongs of baking machines is about 40 ° to 90 ° Devices according to the invention are suitable for cleaning baking tongs with different opening angles, in particular in the range between 40 ° and 90 °.
    Subsequently, the invention will be further explained with reference to exemplary embodiments.
    Fig. 1 shows a schematic oblique view of a laser arrangement according to the invention.
    Fig. 2 shows a side view of a baking tongs and a schematic representation of the laser arrangement according to the invention.
    3 shows a schematic side view of a possible embodiment of a baking oven with three possible positions of the laser arrangement.
    4 shows an illustration of a possible baking machine with the laser arrangement according to the invention in an oblique view.
    5 shows a further alternative embodiment of a baking machine with laser arrangement.
    Fig. 1 shows a schematic embodiment of a laser assembly 2 with a laser head 3, which is arranged to be movable along a plurality of degrees of freedom. In the present embodiment, the laser head 3 is displaceably arranged along a first linear axis 4 and along a second linear axis 5. The illustration of the arrows is symbolic and indicates the displaceability along a first carrier part 7 and a second carrier part 8. In addition, the laser head 3 is arranged pivotable about the first axis of rotation 6 and / or rotatable. The laser head thus has three degrees of freedom, which are preferably driven driven. It should be noted that the arrangement with two linear and one rotational degree of freedom is only one possible embodiment. Depending on the application, fewer, more or other degrees of freedom may be required. To simplify the description, the 14/34 "··· · · · · · · · · · · · · · · ·································
    '••' V: ··· * ··· * ··· * 51 069 GP / GA
    Elements of the device, which serve to move the laser head 3, summarized under the name movement assembly 10. The movement of the laser head refers to a relative movement to fixed parts of the device or the oven or the baking machine. A further relative movement of the baking surfaces to be cleaned is optionally effected by movement of the baking surfaces themselves.
    The laser head 3 has a processing area 9. This is essentially determined by the laser used. In the present case, the processing area 9 is designed as a strip-shaped area. In this strip, the laser beam oscillates. If the processing area 9 of the laser head 3 and / or the laser arrangement is smaller than the required area of use 11 for cleaning the baking surface 1 to be cleaned, then the laser head is moved on the movement arrangement 10 and / or on the movement of the baking surface 1 relative to the baking surface 1 , The speed of movement depends on several parameters. These parameters are, for example, the degree of soiling of the baking surface, the intensity of the laser radiation, the oscillation frequency, the oscillation amplitude and the distance of the laser head from the baking surface. To detect the degree of soiling of the baking surface and to detect the cleaning progress, an optical pickup unit 13 is provided on the device according to the invention. The signals of this optical recording unit 13, which is embodied for example as an image recording device, can be supplied to a data processing unit 14. This data processing unit processes the data of the optical recording device and uses this data to control the cleaning process, in particular for controlling the laser head. This control can affect both the power and intensity of the laser radiation, the oscillation frequency, the oscillation amplitude and the movement of the laser head relative to the baking surface. Furthermore, the controller may also relate to the control of the baking machine itself, in particular the movement of the baking plates.
    According to the invention, the laser arrangement can be firmly connected to the baking machine or the parts of the baking machine. 15/34 • t 19 ···· ···· ···· »« • · · · · · · · 0
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    51 069 GP / GA ^ g · · ··· · »4» # ·
    In a further embodiment, the device can be designed to be mobile in order to be brought to a specific position of the baking machine. In the embodiment as a mobile, modular laser arrangement, there is also the advantage that a laser arrangement can be provided successively on a plurality of baking machines. Thus, the laser assembly can be used to clean multiple baking machines.
    To further increase the flexibility of the laser arrangement, the laser head 3 is arranged to be pivotable about at least the first axis of rotation 6. By this pivoting both horizontally extending as well as obliquely or vertically extending baking surfaces can be edited. In the present embodiment of FIG. 1, the laser arrangement is floor-standing and self-supporting executed. In the region near the ground, it has wheels 15 for movability of the laser arrangement.
    In order to prevent unwanted leakage of reflected laser radiation or dirt particles, a shield 26 is provided. This shield is preferably impenetrable to the laser. The shield 26 is shown schematically. It extends bell-shaped over the insert region 11 of the laser arrangement and / or over the baking surface to be cleaned.
    The shielding arrangement 26 is preferably bell-shaped and has an opening in the direction of the processing area 9. In addition, a further opening may be provided for the extraction of the vaporized contaminants. For this purpose, a suction 25 is provided which further removes the vapors via a blower. The movement of the laser head 3 along the first linear axis 4 and the second linear axis 5 allows a relative movement of the laser head relative to the baking surface. The first linear axis 4 extends substantially normal to the baking direction 19 and parallel to the main extension direction of the baking surface of the first baking plate 17. The second linear axis 5 is substantially normal to the baking direction 19 and parallel to the main extension direction of the baking surface of the second baking plate 18. The first axis of rotation 6 runs in Substantially parallel to the baking movement direction 19 and parallel to the two main extension directions of the baking surfaces of the first and the second baking plate. The laser head can be controlled via the linear axes 4, 5 and 16/34 ···· · · · · »· · ··· ··· ··· ····· ··· ·
    Thus, the first axis of rotation 6 can thus be moved at least transversely to the direction of the backward movement 19. FIG. Another possibility for movement of the laser arrangement is the choice of the distance of the laser head to the respective baking surface to be processed. Thus, in the present embodiment, the distance to the baking surface and the positioning transversely to the baking direction 19 are determined via the movement arrangement 10. The processing area 9 is strip-shaped, with the strip running essentially normal to the baking movement direction 19 on the respective baking surface 1. The processing area 9 can thus be moved substantially along a line via the movement arrangement 10, wherein the line runs in a normal plane to the back movement direction 19. In order to effect a planar cleaning of the baking surface 1, a further degree of freedom and a further possibility of relative movement are provided. Preferably, this is done by the movement of the baking tongs, so the baking surfaces 1 itself. The movement of the baking surface is done in Backbewegungsrichtung 19th
    The opening angle of the baking tongs is preferably 90 °. In principle, however, other opening angles are possible in which the head can be positioned at a certain distance to the baking surface.
    In order to achieve a constant distance in the transverse movement to the baking surface, it is advantageous if the linear axes 4, 5 are each arranged parallel to the respective baking surfaces. However, a distance control can also be done via the control of the linear axes.
    2 shows a schematic side view of a device according to the invention for cleaning one or more baking surfaces 1. For this purpose, the laser head 3 of the laser arrangement 2 is arranged to be displaceable horizontally and / or parallel to the baking surface of the first baking plate 17 along a first linear axis 4 of the first carrier part 7. In a preferred manner, the laser head 3 is arranged to be displaceable vertically and / or parallel to the baking surface of the second baking plate 18 along a second linear axis 5 of the second carrier part 8. In addition, the laser head 3 is arranged to be rotatable about the first axis of rotation 6. This axis of rotation is projecting in the present representation. By turning the laser head 90 ° and / or around 17/34 • ·
    For an angle 180 ° minus the opening angle of the two baking surfaces, the processing area 9 of the laser head can be pivoted from the baking surface of the first baking plate 17 onto the baking surface of the second baking plate 18. The two baking surfaces are designed in the present embodiment as two baking surfaces of a conventional baking tongs for the production of waffles. To clean the two baking surfaces, the baking tongs 16 containing the two baking plates 17,18 is opened about 90 °. Such baking plates are preferably used in wafer baking ovens, in which the schematic baking tongs shown are moved along a baking movement direction 19. The Backbewegungsrichtung 19 extends in the present view of FIG. 2 projecting. In the present embodiment, the processing area 9 of the laser head 3 or the laser arrangement 2 is smaller than the baking surface 1 to be processed. In order nevertheless to be able to achieve cleaning of the entire baking surface 1, the laser head 3 is moved by the movement device 10 as described, such that the processing area is positioned at least once on each point of the insert area 11 to be cleaned. The processing time, processing speed, processing intensity, etc. depends in particular on the type of contamination and the degree of contamination.
    Parameters for controlling the cleaning process are recorded by the optical pickup unit 13, for example. Furthermore, these data can also be linked to or determined by empirical values and / or static values.
    The laser head 3 is, as in the previous embodiment, arranged to be movable parallel to the main extension direction of the baking surface 1. By pivoting the laser head 3 about the first axis of rotation 6, the movement of the laser head is made possible both to the main extension direction of the baking surface of the first baking plate 17 and parallel to the baking surface of the second baking plate 18. This movement takes place, for example, in the illustration plane of FIG. 2. A further relative movement in turn takes place via the movement of the baking plates along the baking movement direction 19, which in this case proceeds in a projecting manner. 18/34 · · · · · ··· ··· ··· ····· · · ·
    fff ........... 51 069 GP / GA
    3 shows a schematic side view of a baking machine, in particular a wafer baking machine. For this purpose, a multiplicity of baking tongs 16, comprising a first baking plate 17 and a second baking plate 18, are arranged along a baking movement direction 19. The baking tongs 16 are guided in a chain around two deflection rollers 20 circumferentially. Via a baking plate control device 21, the baking plates can be opened or closed depending on the position or independently of the position. In normal production operation, the opening and closing of the baking tongs is used for introducing the baking mass to be baked or for removing the finished baked body from the baking tongs. The bodies to be baked are preferably baked with closed baking tongs under the influence of a baking temperature. For cleaning, the baking tongs must also be opened in the present embodiment. In a preferred manner, the opening angle of the baking tongs is for example about 90 °. This corresponds to the angle of the baking surfaces of the first baking plate 17 to the baking surface of the second baking plate 18. Due to the 90-degree opening angle of the laser head can be moved by displacement along two 90 ° to each other linear axes 4, 5 such that the processing area 9 of the laser assembly 2 can clean the entire application area 11, in particular the baking surface 1 to be cleaned.
    The baking plate control device 21 is designed, for example, as a slide control. For this purpose, running or control rollers of the baking plates along raumkurvenförmiger elongated body out to achieve the desired opening of the baking plates.
    In one embodiment of the present invention, a separate cleaning mode for operating the baking machine is provided for cleaning. In this cleaning mode, no baking bodies are produced on the baking surface 1 to be cleaned.
    In the present illustration of FIG. 3, the laser arrangement 2 is provided at three possible exemplary positions. The first position 22 is located in the region of the dough infusion. The second possible position 23 for the laser arrangement 2 is located in the rear deflection region, in particular in the region of the removal of the baked body. A third position 24 is located directly on the pulley. In 19/34 ···· · ········
    In this area, the baking surfaces 1 of both baking plates 17, 18 extend substantially vertically.
    Furthermore, a fourth position 28 of the laser arrangement 2 is shown. Similar to position 24, the laser arrangement is provided in the region of a deflection point. The baking surfaces to be cleaned are substantially vertical during cleaning.
    Preferably, the cleaning of the baking surfaces 1 takes place during a movement of the baking tongs in the baking direction 19. Other movement components and degrees of freedom of the laser head are given by the movement along the first linear axis 4, the second linear axis 5 and by a rotation about the first axis of rotation 6. Together, in the present embodiment by the mobility of the movement assembly 10 and the baking direction 19 three linear, drivable degrees of freedom and a rotary, drivable rotational degree of freedom. These four degrees of freedom make it possible to carry out the control of the laser head in such a way that the entire desired application area 11 and / or the baking surfaces 1 to be cleaned can be cleaned by moving the processing area 9.
    4 shows a schematic external view of a device according to the invention with a baking machine according to the invention. The laser arrangement is located in a region in which the opening of the schematized baking tongs 16 is sufficiently large to position the laser head 3 therein for cleaning the baking surfaces 1. Preferably, the opening is up to or more than 90 °. The cleaning is done mainly by strong heating and evaporation of dirt on the baking surface. To remove the vapors and residues an extraction 25 is provided.
    FIG. 5 shows a further embodiment of a baking machine, which has a laser arrangement 2 for cleaning the baking surface 1. The baking surface 1 extends in the present embodiment of FIG. 5 along an annular, heated baking ring 27. This baking ring is rotatably and drivably disposed about its central axis, which projects projecting in the present view. For cleaning the cylindrical baking surface, the laser arrangement is located in the region of the 20/34 •··············································································.
    51 069 GP / GA ··· ··· ·· ···
    Positioned back ring. The processing area 9 of the laser arrangement 2 and the laser head 3 are movable by actuation of the movement arrangement 10. Again, a movement component, namely the rotation of the baking surface 1 about the central axis of the baking ring 27 is given by the movement of the baking surface 1 itself. A further relative movement, such as, for example, a movement of the laser head 3 and the machining region 9 along a direction parallel to the central axis of the back ring 27, can be provided by a first linear axis 4.
    Preferably, the processing area 9 extends in strip form on the baking surface 1. According to the present embodiment, the strip runs essentially parallel to the center axis of the baking ring, that is projecting in the present view. By moving the laser head 3 of the laser arrangement 2 through the movement arrangement 10, the laser head can be moved laterally and / or transversely to the movement direction of the baking surface 1. In the present configuration, this corresponds to a movement along an axis parallel to the rotation axis of the baking ring.
    According to a further embodiment, the laser arrangement has an optical recording unit 13. The recorded data can be evaluated by the data processing unit 14 and according to the invention influence parameters of the cleaning process. The movement of the laser head, the laser intensity and / or the oscillation frequency is dependent on the shape of the baking surface. Especially with baking plates with a relief-like structure, the contamination in depressions or grooves can be stronger than in straight, flat areas. By the optical pickup unit 13 such forms of the baking surface 1 are detected and purified by appropriate control of the baking machine and / or the laser assembly targeted. In particular, the coupling according to the invention is suitable for controlling the baking machines and the laser arrangement for the shape-dependent cleaning of the baking surface. Even with backplanes with deep cavities, it may be necessary to adjust the focus and direction of the laser depending on the local shape of the baking surface. In particular, for the formation of hollow body waffle bodies such as bags or hemispheres baking surfaces are used with relatively deep indentations. Also for cleaning such baking surfaces is the control according to the invention, which 21/34 ♦ · · ···························································
    The laser arrangement according to the invention and the baking machine according to the invention as well as the method according to the invention are suitable. Another advantage of the shape-dependent control of the laser assembly and the baking machine is the improvement of the efficiency of the cleaning process. For example, baking plates for forming waffle plates have a grid-shaped, relief-like structure. By synchronizing the movement of the laser head and / or the laser beam with the shape of the baking surface, the cleaning efficiency can be further improved. 22/34 • · · · · · · · · · · · · · · · · · · · · · ·
    51 069 GP / GA
    1. Back surface 2. Laser arrangement 3. Laser head 4. First linear axis 5. Second linear axis 6. First rotation axis 7. First support part 8. Second support part 9. Machining area 10. Movement arrangement 11. Area of application 12.-13.optical recording unit 14. Data processing unit 15 Wheels 16. Baking tongs 17. First baking plate 18. Second baking plate 19. Baking direction 20. Deflection rollers 21. Baking plate control device 22. First position 23. Second position 24. Third position 25. Suction 26. Shield 27. Back ring 28. Fourth position 23 / 34
    权利要求:
    Claims (23)
    [1]
    • • • • • · · 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 · · · · · · · · · · · · · · · · · · · · · 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 · 2) for cleaning one or more baking surfaces (l) of a baking machine, comprising a laser head (3), characterized in that an interface for connection to the baking machine is provided, and that the laser arrangement is coupled mechanically and / or tax technically with the baking machine.
    [2]
    2. A laser arrangement according to claim 1, characterized in that the interface comprises a mechanical interface for coupling the laser array with the baking machine and / or a control interface for coupling the control of the baking machine with the control of the laser array.
    [3]
    3. Laser arrangement according to claim 1 or 2, characterized in that a movement device for movement of the laser head is provided.
    [4]
    4. Laser arrangement according to one of claims 1 to 3, characterized in that the laser head along a first linear axis, a second linear axis and / or about a first axis of rotation is movable, wherein the axes are in a predetermined orientation to the / the baking surfaces.
    [5]
    5. Laser arrangement according to one of claims 1 to 4, characterized in that the movement device (9) has a first carrier part (7) for moving the laser head (3) along a first linear axis (4), a second carrier part (8) for moving the Laser head (3) along a second linear axis (5), and / or a first axis of rotation (6) for rotating or for pivoting the laser head comprises. 24/34 • 9 «· · · · · · · · ·············································································································································································································· ...... 51 069 GP / GA
    [6]
    6. Laser arrangement according to one of claims 1 to 5, characterized in that an optical recording unit and a data processing unit for detecting the contamination and / or the cleaning of the baking surfaces is provided.
    [7]
    7. baking machine, characterized in that a laser arrangement (2) is provided according to one of the preceding claims.
    [8]
    8. Baking machine according to claim 7, characterized in that an interface for connection to the laser arrangement is provided.
    [9]
    9. baking machine according to claim 7 or 8, characterized in that the interface comprises a mechanical interface for coupling the laser assembly with the baking machine and / or a control interface for coupling the control of the baking machine with the control of the laser assembly.
    [10]
    10. Baking machine according to one of claims 7 to 9, characterized in that the laser arrangement (2) comprises a laser head (3), from the laser radiation to a processing area (9) on the baking surface (l) is conductive and that the laser head and the Back surface relative to each other at least have a drivable degree of freedom.
    [11]
    11. Baking machine according to one of claims 7 to 10, characterized in that the baking surface and / or the laser head are drivable and movable by at least one drive.
    [12]
    12. Baking machine according to one of claims 7 to 11, characterized in that the laser head and / or the processing area along the baking surface is movable, wherein the direction of movement deviates from the baking direction 19 and preferably transverse to this. 25/34 • · · * 4 4 4 · · · 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 51 069 GP / GA
    [13]
    13. Baking machine according to one of claims 7 to 12, characterized in that the baking machine is designed as a baking tongs, and that the laser arrangement is provided in a region of the baking tongs, in which the baking tongs are opened.
    [14]
    14. Baking machine according to one of claims 7 to 13, characterized in that the laser arrangement is provided in the region of the Vorkopfes, in the service area and / or in a reversal area.
    [15]
    15. Baking machine according to one of claims 7 to 14, characterized in that the baking machine comprises at least one baking tongs with a first and a second baking plate, that on the first baking plate, a first baking surface and on the second baking plate, a second baking surface is provided and that Cleaning the first baking surface to the second baking surface has an opening angle of 40 ° to 120 °, preferably greater than or equal to about 90 °.
    [16]
    16. Baking machine according to one of claims 7 to 12, characterized in that the baking machine is designed as a ring baking machine.
    [17]
    17. A method for cleaning baking surfaces, characterized in that - a laser head in the baking surface of a baking machine is arranged, - that a laser beam for cleaning the baking surface is passed to the baking surface - and that by relative movement between the laser head and the baking surface of the processing area the laser assembly is moved over the baking surface.
    [18]
    18. The method according to claim 17, characterized in that the relative movement is achieved by movement of the baking surface and / or by movement of the laser head. 26/34% • • • • • • • • • '' ·····························································································································································································
    [19]
    19. The method according to claim 17 or 18, characterized in that the laser head and / or the processing area is moved transversely to the baking direction of the baking surface.
    [20]
    20. The method according to any one of claims 17 to 19, characterized in that the baking machine is designed as a baking tongs, that in the region of the Vorkopfs, in the service area or in the region of a deflection of the cleaning area is provided in the baking tongs and the baking surfaces, for example, by 90 ° or more, that the laser head is positioned along the baking surface of the first baking plate in the area of the baking surface until the entire surface is cleaned by the laser beam. that optionally the second baking surface of the second baking plate is cleaned with the laser head, that the baking tongs is closed again, that the subsequent baking plate is brought to the cleaning area and that the process is repeated.
    [21]
    21. The method according to any one of claims 17 to 20, characterized in that the laser arrangement is connected to the baking machine.
    [22]
    22. The method according to any one of claims 17 to 21, characterized in that for cleaning the second baking plate of the laser head is pivoted about a first axis of rotation
    [23]
    23. The method according to any one of claims 17 to 22, characterized in that are recorded by an optical recording unit data and passed to a data processing unit for processing and / or influencing the cleaning process and optionally stored. 27/34 51 069 GP / GA Method according to one of Claims 17 to 34 to 23, characterized in that the data for the detection of the degree of soiling and the contamination of the baking surfaces are used. 25. The method according to any one of claims 17 to 24, characterized in that the data stored associated with a baking plates or a portion of the baking surface and fed to a control device for controlling the laser head in terms of laser power. 26. The method according to any one of claims 17 to 25, characterized in that the control for the laser head is connected to the control of the baking device. 27. The method according to any one of claims 17 to 26, characterized in that the data for controlling parameters such as the speed of progress, the laser intensity, the laser power, the machining area size, the oscillation frequency and / or the oscillation amplitude are used. Method according to one of claims 17 to 27, characterized in that the data for the documentation of parameters such as the speed of progress, the laser intensity, the laser power, the processing area size, the oscillation frequency and / or the oscillation amplitude are stored.



    28/34
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    同族专利:
    公开号 | 公开日
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    WO2014020117A1|2014-02-06|
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    US20150189891A1|2015-07-09|
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    BR112015001956A2|2017-07-04|
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    AT513222B1|2016-11-15|
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    RU2015107379A|2016-09-27|
    PH12015500234A1|2015-03-30|
    CN104519744A|2015-04-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    AT387689B|1986-07-25|1989-02-27|Haas Franz Waffelmasch|CLEANING DEVICE FOR THE DOUGH TREATMENT SURFACES OF WAFFLE BAKING MACHINES|
    DE20308788U1|2003-06-04|2003-08-28|Univ Hannover|Surface treatment unit for e.g. cleaning or excavation, combines high energy laser beam, high velocity dry ice jet and suction connection in portable unit|
    WO2012150199A1|2011-05-02|2012-11-08|Rapido-Tech Gmbh|Method for cleaning baking plates of an automatic baking system and cleaning device|US20180242593A1|2015-08-28|2018-08-30|Haas Food Equipment Gmbh|Arrangement and method for cleaning half shell-shaped baking mold cavities|SU824930A1|1979-05-31|1981-04-30|Guba Nikolaj|Device for baking mobile dough products|
    DE3721940C2|1987-07-02|1989-04-06|Ibm Deutschland Gmbh, 7000 Stuttgart, De|
    US5373140A|1993-03-16|1994-12-13|Vernay Laboratories, Inc.|System for cleaning molding equipment using a laser|
    DE19517218C1|1995-05-11|1996-07-18|Uniroyal Englebert Gmbh|Tyre vulcanising mould cleaning process|
    IT1282722B1|1996-03-01|1998-03-31|Pirelli|METHOD AND APPARATUS FOR THE CLEANING OF VULCANIZATION MOLDS OF ELASTOMERIC MATERIAL ARTICLES|
    SG77617A1|1997-12-18|2001-01-16|Advanced Systems Automation|A system for removing surface contaminants on moulds used in semiconductor packaging tools|
    US6369353B1|1998-02-20|2002-04-09|The Goodyear Tire & Rubber Company|Robotic laser tire mold cleaning system and method of use|
    JP2006055954A|2004-08-20|2006-03-02|Fanuc Ltd|Robot for laser beam machining, and robot system|
    CN1895063A|2005-07-15|2007-01-17|乐金电子电器有限公司|Illuminating light of electric oven|
    EP2149755B1|2008-07-30|2012-12-05|Electrolux Home Products Corporation N.V.|Oven and method of operating the same|DE102015100034A1|2015-01-05|2016-07-07|Hebenstreit Gmbh|Cleaning device for baking plates of a baking machine system|
    EP3138636A1|2015-09-03|2017-03-08|Haas Food Equipment GmbH|Assembly for the purification of baking surfaces|
    CN106513381A|2016-10-27|2017-03-22|苏州菲镭泰克激光技术有限公司|Laser cleaning device and method for axis parts|
    ES2636715B2|2017-06-07|2018-02-12|Sitexco Girona, S.L.|Anilox laser roller cleaning machine and procedure for self-adjusting the laser focal point to the diameter of the anilox roller.|
    US10737303B2|2017-06-23|2020-08-11|Lockheed Martin Corporation|Nutplate preparation laser system|
    CN109319545B|2018-11-09|2021-02-05|湖南润沅新材料有限公司|Lithium ion battery diaphragm is rolled up and is used edulcoration device|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA863/2012A|AT513222B1|2012-08-03|2012-08-03|Method and device for cleaning baking surfaces|ATA863/2012A| AT513222B1|2012-08-03|2012-08-03|Method and device for cleaning baking surfaces|
    BR112015001956-0A| BR112015001956B1|2012-08-03|2013-08-01|machine for the manufacture of bakery products and method for cleaning surfaces for the manufacture of bakery products|
    JP2015524790A| JP2015524661A|2012-08-03|2013-08-01|Method and apparatus for cleaning a baking surface|
    RU2015107379A| RU2615471C2|2012-08-03|2013-08-01|Method and device for cleaning hearth spaces|
    CN201380041226.XA| CN104519744B|2012-08-03|2013-08-01|The method and apparatus that cleaning bakees surface|
    PCT/EP2013/066205| WO2014020117A1|2012-08-03|2013-08-01|Method and device for cleaning baking surfaces|
    KR20157005578A| KR20150034813A|2012-08-03|2013-08-01|Method and device for cleaning baking surfaces|
    EP13742659.9A| EP2879500B1|2012-08-03|2013-08-01|Method and device for cleaning baking surfaces|
    US14/419,287| US20150189891A1|2012-08-03|2013-08-01|Method and apparatus for cleaning baking surfaces|
    PH12015500234A| PH12015500234A1|2012-08-03|2015-02-02|Method and device for cleaning baking surfaces|
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